Existing Analysis and Track Record

Our customers include global semiconductor operating companies, renowned IP law firms, and other owners of semiconductor IP. Due to the nature of the services we offer, we maintain a strict confidentiality policy and do not disclose who our specific clients are. However, many are household names and the others are well-known to anyone working in the semiconductor industry. 

Delivery Statistics since our Founding in 2017

1
Satisfied clients
1
Project deliveries
1
Devices Analyzed
1 +
Claims documented

Existing reports and analysis by category

Apple
Qualcomm
Sandisk
Microsoft
Samsung
AMD
IBM
Mellanox
Micron
Mitsubishi
Bosch
STMicroelectronics
Maxim
Nintendo
MediaTek
Xilinx
Macronix
Powerchip
General Motors
Sony
NVIDIA
NVIDIA GP104 (GeForce GT1070) GPU
Mellanox Ethernet Switch
Sandisk USB Memory
Mitsubishi RF Device
STMicroelectronics IIS328DQ 3-axis Accelerometer
Microsoft XBOX ONE CPU
MediaTek Helio P20 (MT6757)
Qualcomm PMIC
IBM Processor
Macronix XtraROM
Samsung 3D NAND SRAM
Xilinx Virtex 2 Pro
AMD Athlon 3200+ CPU
Qualcomm WCN3990 2×2 802.11ac Wifi
Powerchip NAND
Bosch BMI055 Inertial Sensor
Micron DDR4 DRAM
Nintendo ROM
Qualcomm MSM8992 Snapdragon 808 SoC
Bosch BMI260 Inertial Sensor
Qualcomm MSM8998 Snapdragon 835 APU
General Motors Sensor Module
Apple A11 APU
Sony CMOS Image Sensor
Bosch BMI160 Inertial Sensor
STMicroelectronics ISM330DLC Inertial Sensor
STMicroelectronics CMOS Image Sensor
Bosch BMA280 Accelerometer
MediaTek X20 (MT6797W) APU
Xillinx Spartan 3
Non-Infringement Analysis
Planar imaging of SRAM cells
Layout analysis
Package and bevel layout analysis
Circuit schematic extraction
Brief die analysis
Circuit patent evidence of use
Patent Categorization
Board tracing
Brief die analysis
Custom circuit simulation
Patent Reviews
Package cross-section analysis
Process structure
Process patent evidence of use
Package layout high resolution imaging
Package, die photo, delayering
Sensor module analysis
Prior Use Analysis
GPIO block
GDDR5X interface circuit
RF Power Amplifier (PA)
Inertial sensor circuits and structures
OLED modules
CIS column comparator circuit
Temperature sensors and control circuits
GPU layout
Dummy metals in SRAM interconnect
VCO
6T and 8T SRAM
RF devices
GPU charge pump circuit
Level 2 Cache SRAM
PMIC
GPU comparator circuit
CIS layout analysis
Phase-Lock-Loop (PLL)

Selected Circuit Analysis Reports

Qualcomm Snapdragon 835 APU

PLL Block Circuit Analysis Report
10nm FinFET process in Samsung LPE Technology


Hierarchically organized schematics and high-resolution layout images
Report delivered with interactive software
Package markings: Qualcomm MSM8998 102-AB
Die markings: Qualcomm HG11-P2519-1

NVIDIA GP104 GeForce GT1070

GDDR5 Interface Circuit Analysis Report
TSMC 14-metal, 16nm FinFET process

Hierarchically organized schematics and high-resolution layout images
Report delivered with interactive software
Die markings: NVIDIA GP104-A01 2015

Report enquiries can be submitted below:

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