Satisfied clients
1
Project deliveries
1
Devices Analyzed
1
Claims documented
1
+
Existing Analysis and Track Record
Our customers include global semiconductor operating companies, renowned IP law firms, and other owners of semiconductor IP. Due to the nature of the services we offer, we maintain a strict confidentiality policy and do not disclose who our specific clients are. However, many are household names and the others are well-known to anyone working in the semiconductor industry.
Delivery Statistics since our Founding in 2017
Existing reports and analysis by category
| Apple |
| Qualcomm |
| Sandisk |
| Microsoft |
| Samsung |
| AMD |
| IBM |
| Mellanox |
| Micron |
| Mitsubishi |
| Bosch |
| STMicroelectronics |
| Maxim |
| Nintendo |
| MediaTek |
| Xilinx |
| Macronix |
| Powerchip |
| General Motors |
| Sony |
| NVIDIA |
| NVIDIA GP104 (GeForce GT1070) GPU |
| Mellanox Ethernet Switch |
| Sandisk USB Memory |
| Mitsubishi RF Device |
| STMicroelectronics IIS328DQ 3-axis Accelerometer |
| Microsoft XBOX ONE CPU |
| MediaTek Helio P20 (MT6757) |
| Qualcomm PMIC |
| IBM Processor |
| Macronix XtraROM |
| Samsung 3D NAND SRAM |
| Xilinx Virtex 2 Pro |
| AMD Athlon 3200+ CPU |
| Qualcomm WCN3990 2×2 802.11ac Wifi |
| Powerchip NAND |
| Bosch BMI055 Inertial Sensor |
| Micron DDR4 DRAM |
| Nintendo ROM |
| Qualcomm MSM8992 Snapdragon 808 SoC |
| Bosch BMI260 Inertial Sensor |
| Qualcomm MSM8998 Snapdragon 835 APU |
| General Motors Sensor Module |
| Apple A11 APU |
| Sony CMOS Image Sensor |
| Bosch BMI160 Inertial Sensor |
| STMicroelectronics ISM330DLC Inertial Sensor |
| STMicroelectronics CMOS Image Sensor |
| Bosch BMA280 Accelerometer |
| MediaTek X20 (MT6797W) APU |
| Xillinx Spartan 3 |
| Non-Infringement Analysis |
| Planar imaging of SRAM cells |
| Layout analysis |
| Package and bevel layout analysis |
| Circuit schematic extraction |
| Brief die analysis |
| Circuit patent evidence of use |
| Patent Categorization |
| Board tracing |
| Brief die analysis |
| Custom circuit simulation |
| Patent Reviews |
| Package cross-section analysis |
| Process structure |
| Process patent evidence of use |
| Package layout high resolution imaging |
| Package, die photo, delayering |
| Sensor module analysis |
| Prior Use Analysis |
| GPIO block |
| GDDR5X interface circuit |
| RF Power Amplifier (PA) |
| Inertial sensor circuits and structures |
| OLED modules |
| CIS column comparator circuit |
| Temperature sensors and control circuits |
| GPU layout |
| Dummy metals in SRAM interconnect |
| VCO |
| 6T and 8T SRAM |
| RF devices |
| GPU charge pump circuit |
| Level 2 Cache SRAM |
| PMIC |
| GPU comparator circuit |
| CIS layout analysis |
| Phase-Lock-Loop (PLL) |
Selected Circuit Analysis Reports
NVIDIA GEFORE GTX1070Ti WINDFORE 8G
Charge Pump and Related Circuits of the PLL
Circuit Analysis Report
TSMC 14-metal, 16nm FinFET process
Hierarchically organized schematics and high-resolution layout images
Report delivered with interactive software
Die markings: NVIDIA GP104-A01 2015
Qualcomm Snapdragon 835 APU
PLL Block Circuit Analysis Report
10nm FinFET process in Samsung LPE Technology
Hierarchically organized schematics and high-resolution layout images
Report delivered with interactive software
Package markings: Qualcomm MSM8998 102-AB
Die markings: Qualcomm HG11-P2519-1
NVIDIA GP104 GeForce GT1070
GDDR5 Interface Circuit Analysis Report
TSMC 14-metal, 16nm FinFET process
Hierarchically organized schematics and high-resolution layout images
Report delivered with interactive software
Die markings: NVIDIA GP104-A01 2015