This report presents a partial circuit analysis of a selected repeating I/O pads on a GDDR5X interface of the GP104 GPU. The GP104 GPU die is made in TSMC 14-metal, 16nm FinFET process with a die size of 19.3mm by 16.4mm.This report consists of the circuit analysis of the selected GDDR5X data I/O pad, organized hierarchically in transistor-level. The report is presented in both pdf format for general review and IC Explorer for crossing circuitlayout review. The IC Explorer can output industry formats of netlists including SPICE, Verilog, VHDL, and EDIF200 for function verification and performance simulations.
Schematic 1.0.0 shows the top level diagram of the selected GDDR5X high speed DQ I/O circuit on the NVIDIA GP104 GPU die. The partially analyzed circuits are organized in seven subcircuits: Schematic 2.0.0 Clock Circuit, Schematic 3.0.0 Reference Generator, Schematic 4.0.0 Data Input Path, Schematic 5.0.0 Driver with ODT, Schematic 6.0.0 Switch and Schematic 7.0.0 Power Supply Switches.
The schematic 2.0.0 shows clock generating circuits of this DQ I/O pad. Two pairs of processed clock signals are sent to the Schematic 4.0.0 Data Input Path and Schematic 5.0.0 Driver with ODT. An additional pair of processed clock signals are send to the unanalyzed standard-cell digital area that is not far away from the clock generating block.
The Reference Generator in Schematic 3.0.0 is a high accuracy resistor ladder which generates a pair of precise voltages VRH/VRL for data input circuits as references… Unlock the full report
The report includes the full design review.
1.0.0 Top Level Diagram
2.0.0 Clock Circuit
3.0.0 Reference Generator
4.0.0 Data Input Path,
5.0.0 Driver with ODT
6.0.0 Switch
7.0.0 Power Supply Switches
The report includes the interactive schematic and layout image database at high-resolution.
Apple |
Qualcomm |
Sandisk |
Microsoft |
Samsung |
AMD |
IBM |
Mellanox |
Micron |
Mitsubishi |
Bosch |
STMicroelectronics |
Maxim |
Nintendo |
MediaTek |
Xilinx |
Macronix |
Powerchip |
General Motors |
Sony |
NVIDIA |
NVIDIA GP104 (GeForce GT1070) GPU |
Mellanox Ethernet Switch |
Sandisk USB Memory |
Mitsubishi RF Device |
STMicroelectronics IIS328DQ 3-axis Accelerometer |
Microsoft XBOX ONE CPU |
MediaTek Helio P20 (MT6757) |
Qualcomm PMIC |
IBM Processor |
Macronix XtraROM |
Samsung 3D NAND SRAM |
Xilinx Virtex 2 Pro |
AMD Athlon 3200+ CPU |
Qualcomm WCN3990 2×2 802.11ac Wifi |
Powerchip NAND |
Bosch BMI055 Inertial Sensor |
Micron DDR4 DRAM |
Nintendo ROM |
Qualcomm MSM8992 Snapdragon 808 SoC |
Bosch BMI260 Inertial Sensor |
Qualcomm MSM8998 Snapdragon 835 APU |
General Motors Sensor Module |
Apple A11 APU |
Sony CMOS Image Sensor |
Bosch BMI160 Inertial Sensor |
STMicroelectronics ISM330DLC Inertial Sensor |
STMicroelectronics CMOS Image Sensor |
Bosch BMA280 Accelerometer |
MediaTek X20 (MT6797W) APU |
Xillinx Spartan 3 |
Non-Infringement Analysis |
Planar imaging of SRAM cells |
Layout analysis |
Package and bevel layout analysis |
Circuit schematic extraction |
Brief die analysis |
Circuit patent evidence of use |
Patent Categorization |
Board tracing |
Brief die analysis |
Custom circuit simulation |
Patent Reviews |
Package cross-section analysis |
Process structure |
Process patent evidence of use |
Package layout high resolution imaging |
Package, die photo, delayering |
Sensor module analysis |
Prior Use Analysis |
GPIO block |
GDDR5X interface circuit |
RF Power Amplifier (PA) |
Inertial sensor circuits and structures |
OLED modules |
CIS column comparator circuit |
Temperature sensors and control circuits |
GPU layout |
Dummy metals in SRAM interconnect |
VCO |
6T and 8T SRAM |
RF devices |
GPU charge pump circuit |
Level 2 Cache SRAM |
PMIC |
GPU comparator circuit |
CIS layout analysis |
Phase-Lock-Loop (PLL) |