Charge Pump and Related Circuits of the PLL
Images from the report
NVIDIA GP104-300-A1 GPU (GTX1070Ti)
Circuit Analysis Report
The NVIDIA GTX1070Ti GPU is based on NVIDIA Pascal™ GPU architecture. The analyzed GP104-300-A1 GPU die is found on a GEFORE(R) GTX1070Ti WINDFORE 8G gaming graphics card.
From the report’s design overview:
We identified two types of PLL blocks on the GP104-300-A1 GPU die: one with a coil inductor and one without a coil inductor. The analyzed PLL is of the latter type: the PLL without a coil inductor. The same PLL blocks are visible on different locations of the GP104-300-A1 die.
Similar PLL blocks are also found on other NVIDIA GPU dies, such as GTX 1080, Quadro P4000, Quadro P5000 and Tesla P4. This partial circuit analysis report includes a selected portion of the PLL block: Charge pump, direct control signals of the charge pump and an LDO regulator that provides power supplies to the charge pump and most of the PLL circuits on the GP104-300-A GPU die.
The partial circuit analysis report is organized hierarchically at the transistor-level. The GP104-300-A1 GPU die is made in TSMC 14-metal, 16nm FinFET process with a die size of 19.3mm by 16.4mm… Unlock the full report
The report includes interactive schematics for the following subcircuits:
1.0.0 PLL Top Schematic
2.0.0 Control Data
2.1.0 Data Input
2.1.1 Power On Delay
2.1.2 PLL Enable Signals
2.2.0 Control Signal
2.3.0 CP Enable Signal
3.0.0 Charge Pump
3.1.0 CP Start Up
3.2.0 Up Down Signals
3.3.0 Down Reference
3.4.0 Up Reference
3.6.0 OP Amp
3.7.0 Voltage Follower
3.8.0 Up Current
3.9.0 Down Current
3.10.0 Decoder
4.0.0 VCO Supply Voltage
6.0.0 VDD1 LDO
6.1.0 Programmable R
6.2.0 Pull Down
6.3.0 Amp 1
6.4.0 Amp 2
6.5.0 Reference Voltage
The report includes the interactive schematic and layout image database at high-resolution.
Also check out our Qualcomm report:
Qualcomm Snapdragon 835 APU
PLL Block Circuit Analysis Report
10nm FinFET process in Samsung LPE Technology
Hierarchically organized schematics and high-resolution layout images
Report delivered with interactive software
Package markings: Qualcomm MSM8998 102-AB
Die markings: Qualcomm HG11-P2519-1
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